interlayer connection
ŒÓég½Ó¾A{} (¤½¤¦¤«¤ó¤»¤Ä¤¾¤¯)
ŒÓégßB½Ó{} (ceng2jian1lian2jie1)
internal layer
ƒÈŒÓ{} (¤Ê¤¤¤½¤¦)
ƒÈŒÓ{} (nei4ceng2)
jumper
¥¸¥ã¥ó¥Ñ{} (¤¸¤ã¤ó¤Ñ)
¿ç½Ó¾€{}{} (kua4jie1xian4)
laminate
·eŒÓ°å{} (¤»¤¤½¤¦¤Ð¤ó)
ŒÓ‰º°å{} (ceng2ya1ban3)
==> copper-clad laminate
lamination
·eŒÓ{} (¤»¤¤½¤¦)
ŒÓ‰º{} (ceng2ya1)
land
¥é¥ó¥É{} (¤é¤ó¤É)
ßB½Ó±P{} (lian2jie1pan2)
==> pad
land breakout
==> hole breakout
land spacing
¥é¥ó¥Éég϶{} (¤é¤ó¤É¤«¤ó¤²¤)
ßB½Ó±Pég¾à (lian2jie1pan2jian1ju4)
landless plated-through hole
¥é¥ó¥É¥ì¥¹¥Û©`¥ë{} (¤é¤ó¤É¤ì¤¹¤Û©`¤ë)
ŸoßB½Ó±P¿×{} (wu2lian2jie1pan2kong3)
layer
ŒÓ{} (¤½¤¦)
ŒÓ{} (ceng2)
layer registration
==> layer-to-layer registration, layer registration
layer-to-layer registration, layer registration
ŒÓégλÖúϤ»{} (¤½¤¦¤«¤ó¤¤¤Á¤¢¤ï¤»)
ŒÓégÖغ϶È{} (ceng2jian1chong2he2du4)
layer-to-layer spacing
Œ§ówŒÓégºñ¤µ{} (¤É¤¦¤¿¤¤¤½¤¦¤«¤ó¤¢¤Ä¤µ)
ŒÓég¾à{} (ceng2jian1ju4)
legend, (symbol mark)
¥Þ©`¥¥ó¥°£¬£¨¥·¥ó¥Ü¥ë¥Þ©`¥¯£©{} (¤Þ©`¤¤ó¤°£¬¤·¤ó¤Ü¤ë¤Þ©`¤¯)
×ÖÔª{} (zi4fu2)
(*) GB standard has "˜ËÕI"{}(mark) also.
location hole
==> tooling hole, (location hole)
location notch
»ùœÊ¥Î¥Ã¥Á{} (¤¤¸¤å¤ó¤Î¤Ã¤Á)
¶¨Î»²Û (ding4wei4cao2)
manufacturing drawing
ÑuÔì‡íÃæ{} (¤»¤¤¤¾¤¦¤º¤á¤ó)
¼Ó¹¤ˆD{}{} (jia1gong1du2)
mass lamination
¥Þ¥¹¥é¥ß¥Í©`¥·¥ç¥ó{} (¤Þ¤¹¤é¤ß¤Í©`¤·¤ç¤ó)
³ÉÅúŒÓ‰º (cheng2pi1ceng2ya1)
mealing
¥ß©`¥ê¥ó¥°{} (¤ß©`¤ê¤ó¤°)
·Ûüc{} (fen3dian3)
measling
¥ß©`¥º¥ê¥ó¥°{} (¤ß©`¤º¤ê¤ó¤°)
°×¼y{} (bai2wen2)
metal core base material
¥á¥¿¥ë¥³¥¢»ù°å{} (¤á¤¿¤ë¤³¤¢¤¤Ð¤ó)
½ðŒÙо»ù²Ä (jin1shu3xin1ji1cai2)
(*) From ½ðŒÙо¸²ã~²ŒÓ‰º°å{}.
metal core printed wiring board
¥á¥¿¥ë¥³¥¢¥×¥ê¥ó¥ÈÅä¾€°å{} (¤á¤¿¤ë¤³¤¢¤×¤ê¤ó¤È¤Ï¤¤¤»¤ó¤Ð¤ó)
½ðŒÙоӡÑu°å{} (jin1shu3xin1yin4zhi4ban3)
metal migration
£Û¥á¥¿¥ë£Ý¥Þ¥¤¥°¥ì©`¥·¥ç¥ó{} (¤á¤¿¤ë¤Þ¤¤¤°¤ì©`¤·¤ç¤ó)
½ðÊôǨÒÆ (jin1shu3qian1yi2)
metal-clad base material